Bridge Neurotech is building a non-invasive functional ultrasound imaging (fUSI) platform with AI-based neural decoding for brain-computer interface applications. It is a seed-stage neurotechnology company based in Redwood City, with custom hardware, imaging science, real-time compute, neural decoding and research studies under one roof.

About the role

This role owns the architecture strategy and delivery of the electronic systems behind Bridge's custom ultrasound hardware: system partitioning and component selection through schematic, layout, bring-up and validated hardware.

Two design challenges sit at the centre. The first is high-speed I/O, moving raw acquisition data off the front-end over multi-gigabit-per-second links with a focus on signal integrity, clocking and layout. The second is power delivery, with multi-rail systems operating at watts of power designed for efficiency and thermal headroom.

What you will do

• Own the end-to-end electronics architecture, from partitioning and component selection through bring-up and design validation.
• Deliver boards with multi-gigabit-per-second serial links such as LVDS, JESD204 and PCIe or USB 3.x-class SerDes, owning signal integrity, impedance control and high-speed layout.
• Architect watts-class power delivery: multi-rail regulation, sequencing, efficiency, thermal design and noise isolation for sensitive analog acquisition circuitry.
• Evaluate, select and integrate ultrasound transmit and receive ASICs and analog front-ends, and drive vendor relationships.
• Co-define the hardware and software boundary with the Embedded Systems Lead, and write firmware where it accelerates bring-up.
• Build Python-based bring-up, characterisation and automated test tooling for every board revision.
• Mentor the R&D Engineer and lay the documentation and design-control groundwork for eventual regulated development.

What they are looking for

• A degree in electrical engineering or a related field, with 6+ years of hands-on board-level design and multiple custom boards taken through production.
• Extended experience with high-speed digital board design and signal and power integrity analysis.
• Demonstrated design of watts-class power delivery systems.
• A working understanding of ASICs, including register-level configuration and electrical integration of custom silicon.
• Enough firmware fluency to write embedded code, and good command of Python.
• Experience from consumer electronics or other high-volume products where cost, manufacturability and iteration speed were real constraints.