INBRAIN is a team of scientists, doctors, engineers and humanity lovers building neuroelectronic interfaces to cure brain disorders, harnessing the properties of graphene to build safe, non-invasive and highly efficient neural solutions.
As Senior MEMS Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure — inventing, building and operating the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability).
This position is office-based in Bellaterra.
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